MECHANIC FXS-9/ FX-9 0.02mm jumper wire for iPhone fingerprint repair / PCB BGA sodering point. 0.01 0.02mm Jump Wire for iPhone Motherboard Chip 99.6% Insulated Fingerprint Flying Soldering Repairing Copper Conductor,  iPhone Chip Conductor Wire for PCB BGA Sodering Point, Ensure There is no Short-Circuit Between 0.1mm Solder Joints, Totally Beat Handset Cable.

Product Features:

•  MECHANIC FXS-9/ FX-9 0.02mm jumper wire for iPhone fingerprint repair / PCB BGA sodering point.
•  Special material:  Pure copper wire line with conductive surface. 
•  0.02 mm super precision diametaer, portable, easy to be straightened.
•  Insulated Jumper wire to avoid shorting with other components.
•  0.01mm thin and 200m in length jumper wire .
•  Super compacity: for Elevtronics, iPhone and Android cellphone logic board repair.
•  Good toughness, not easy to break.
•  Ideal for running jumpers on circuit board.

  Product Specification​

• Diameter: 0.01mm/0,02mm.
• Length:200m.
• Material: 99.6% Copper.
• Application: for iPhone motherboard PAB,BGA soldering repaing jump wire.
• Solder Joint Spacing: 0.1mm.
• Ultra-fine 6-generation fingerprint chip jumper copper line.

   [ Option ]

• FX-9:  Non insulated Jump Wire.
• FXS-9: Insulation Type (insulated) Jump Wire.
• 0.01mm Insulated Jump Wire.